Method of producing a biometric sensor

US6836953B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Manfred Fries · Hunderdorf, DE
• Thomas Münch · Hemau, DE
• Reinhard Fischbach · Birkenfeld, DE

Key dates

• Filing date: Nov 6, 2002
• Grant date: Jan 4, 2005
• Expiry date: Jun 20, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49171
• WIPO field: Control
• WIPO sector: Instruments

Abstract

In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.