Deposition uniformity control for electroplating apparatus, and associated method
US6837978B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2000 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Dec 10, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and associated apparatus for electro-chemically depositing a metal film on a substrate having a metal seed layer. The apparatus comprises a substrate holder that holds the substrate. The electrolyte cell receives the substrate in a processing position. The actuator is connected to the substrate holder and adjustably positions the substrate relative to the electrolyte cell. The method involves electro-chemically depositing a metal film on a substrate having a metal seed layer comprising disposing the substrate in an electrolyte cell that is configured to receive the substrate. The method comprises adjustably positioning the substrate relative to the electrolyte cell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.