Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US6837984B2 · kind B2 · utility
6Cited by
25References
35Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 10, 2002 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Apr 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7684
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for electropolishing a wafer includes a wafer chuck and a stationary jet. The wafer chuck is configured to rotate and translate the wafer. The stationary jet is configured to apply an electrolyte to the wafer when the wafer is translated and rotated by the wafer chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.