Rework method for finishing metallurgy on chip carriers
US6838009B2 · kind B2 · utility
3Cited by
9References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2001 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Jul 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0361
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for reworking of finishing metallurgy on pads of electronic components. The pads are copper or copper/nickel and have a layer of nickel thereon and an overlying layer of gold. The gold layer is removed first followed by the nickel layer and then the component is treated to remove etch and corrosion products. Media blasting is then used to restore the pads to their original condition as on prime parts. The pads are then replated using conventional nickel and gold plating solutions to form the reworked component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.