Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
US6838170B2 · kind B2 · utility
8Cited by
2References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2003 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Feb 6, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature of −10° C. or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.