Molded flip chip package
US6838313B2 · kind B2 · utility
11Cited by
15References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2003 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Jul 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing a molded flip chip package is described. According to one embodiment, an incomplete flip chip package comprising a thin substrate and a silicon chip is placed in a mold, and a resin is injected into the mold filling the gap between the surface of the flip chip and the adjacent substrate, and the resin is cured by maintaining the mold at an elevated temperature for a predetermined amount of time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.