Semiconductor device manufacturing method using ultrasonic flip chip bonding technique
US6838316B2 · kind B2 · utility
8Cited by
12References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2003 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Mar 5, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bump is formed on at least one of a semiconductor chip and printed circuit board. A sealing material is applied to the surface of one of the semiconductor chip and printed circuit board. The printed circuit board is flip-chip-connected to the semiconductor chip via the sealing material while ultrasonic waves are applied to the printed circuit board to promote bonding by the bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.