Two heat sources for welding silicon
US6838636B2 · kind B2 · utility
0Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2003 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Jun 18, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of welding two silicon workpieces (20, 22) together into one member without the formation of cracks along the weld. A first method passes current (34, 36) through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. A second method passing current (34) through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.