Module assembly for stacked BGA packages
US6838768B2 · kind B2 · utility
15Cited by
80References
19Claims
0Family size
Inventors
Key dates
| Filing date | May 8, 2003 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | May 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.