Leonard E. Mess
45Patents
17h-index
7Co-inventors
70Inventor score
Filing activity: Jul 23, 1997 → Feb 22, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6294839A | Apparatus and methods of packaging and testing die | Electricity | 231 | Expired |
| US6297548A | Stackable ceramic FBGA for high thermal applications | Electricity | 217 | Expired |
| US6297960A | Heat sink with alignment and retaining features | Emerging Cross-Sectional Technologies | 119 | Expired |
| US6900528B2 | Stacked mass storage flash memory package | Electricity | 118 | Expired |
| US7262506B2 | Stacked mass storage flash memory package | Electricity | 64 | Expired |
| US6563217B2 | Module assembly for stacked BGA packages | Electricity | 59 | Expired |
| US6414391B1 | Module assembly for stacked BGA packages with a common bus bar in the assembly | Electricity | 40 | Expired |
| US6760224B2 | Heat sink with alignment and retaining features | Emerging Cross-Sectional Technologies | 38 | Expired |
| US7704794B2 | Method of forming a semiconductor device | Electricity | 31 | Active |
| US6291265A | Method of manufacturing an interposer | Electricity | 28 | Expired |
| US6224936A | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Electricity | 27 | Expired |
| US6007317A | Ball grid array (BGA) encapsulation mold | Emerging Cross-Sectional Technologies | 25 | Expired |
| US6525943B2 | Heat sink with alignment and retaining features | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6512302B2 | Apparatus and methods of packaging and testing die | Electricity | 22 | Expired |
| US6650007B2 | Stackable ceramic fbga for high thermal applications | Electricity | 21 | Expired |
| US6380631B2 | Apparatus and methods of packaging and testing die | Electricity | 21 | Expired |
| US6472252B2 | Methods for ball grid array (BGA) encapsulation mold | Electricity | 18 | Expired |
| US6838768B2 | Module assembly for stacked BGA packages | Electricity | 15 | Expired |
| US6558966B2 | Apparatus and methods of packaging and testing die | Electricity | 15 | Expired |
| US5923959A | Ball grid array (BGA) encapsulation mold | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6858926B2 | Stackable ceramic FBGA for high thermal applications | Electricity | 12 | Expired |
| US6777965B1 | Interposer for electrically coupling a semiconductive device to an electrical apparatus | Electricity | 10 | Expired |
| US6577019B1 | Alignment and orientation features for a semiconductor package | Electricity | 10 | Expired |
| US7375419B2 | Stacked mass storage flash memory package | Electricity | 9 | Expired |
| US6164946A | Ball grid array (BGA) encapsulation mold | Emerging Cross-Sectional Technologies | 8 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.