Apparatus for mounting semiconductor chips
US6839958B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2001 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Dec 3, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53183
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for the mounting of semiconductor chips comprises a bondhead with a pick-up tool with a longitudinal drill hole to which vacuum can be applied for the gripping and transport of a semiconductor chip. To detect whether the pick-up tool has gripped the semiconductor chip, a body with a reflecting surface is arranged in the longitudinal drill hole of the pick-up tool which, when passing over the light source on absence of the semiconductor chip deflects light shining from underneath into the longitudinal drill hole of the pick-up tool into a horizontal plane. The pick-up tool has locations which are pervious to the deflected light of the light source. At least one optical element is arranged on the bondhead which concentrates at least part of the deflected light emerging laterally from the pick-up tool onto a photosensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.