Micromechanical component and pressure sensor having a component of this type
US6840111B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2002 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Sep 29, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0052
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromechanical component in which lateral deformations, i.e., deformations of the component parallel to its two main surfaces, are concentrated in a defined area of the component structure, making it possible to decouple lateral and vertical stresses in the component. The component structure includes at least one bellows-like structure in which lateral deformations of the component are concentrated. A pressure sensor having a micromechanical component of this type may be used, for example, for measured-value detection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.