Substrate processing apparatus equipping with high-pressure processing unit
US6841031B2 · kind B2 · utility
23Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2002 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Jul 23, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67173
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
With respect to any one of processing units, a main transportation path, a developing unit, a dedicated transportation robot and a high-pressure processing unit are disposed linearly in this order in a direction. Hence, even if a processing fluid adhering to a substrate or an evaporant of the processing fluid moves toward the main transportation path while the high-pressure processing unit transports the substrate wet with the processing fluid, there are the processing units located which the processing fluid or its evaporant must arrive at before reaching the main transportation path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.