Method and apparatus for substrate polishing
US6841057B2 · kind B2 · utility
12Cited by
25References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2002 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Dec 14, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F7/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.