Injection molding apparatus and method
US6841103B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2001 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Jan 17, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2945/76943
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention is directed to an injection molding apparatus and method capable of preventing the occurrence of over-packing. The apparatus includes a pair of dies for forming a plurality of cavities therebetween; die closing devices for closing the pair of dies under a prescribed pressure; an injection device for injecting a molten resin into respective cavities under a prescribed pressure; and, a control device for controlling the die closing devices and the injection device. Further, the apparatus comprises a plurality of pressure sensors for detecting respective pressures in respective cavities and a control device that controls the injection device and/or the die closing devices to reduce the rate of injection of the molten resin and/or the force of closing the dies and, otherwise, stops the injection and/or the die closing operation when the pressure difference between cavities is found to be greater than a prescribed value on the basis of sensed values from the respective pressure sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.