Structure having embedded flush circuitry features and method of fabricating
US6841228B2 · kind B2 · utility
3Cited by
14References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2003 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Sep 3, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embedded flush circuitry features are provided by depositing a conductive seed layer on the front side of a sacrificial carrier; plating a layer of conductive metal onto the seed layer and personalizing circuitry features. The front side of the carrier film is embedded into a dielectric material and the sacrificial carrier film is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.