Robert D. Edwards
10Patents
5h-index
39Co-inventors
62Inventor score
Filing activity: May 8, 1989 → May 13, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5733466A | Electrolytic method of depositing gold connectors on a printed circuit board | Electricity | 63 | Expired |
| US4969979A | Direct electroplating of through holes | Electricity | 56 | Expired |
| US6414509B1 | Method and apparatus for in-situ testing of integrated circuit chips | Electricity | 10 | Expired |
| US7223476B2 | Composite flakes and methods for making and using the same | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6086946A | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby | Emerging Cross-Sectional Technologies | 5 | Expired |
| US5363553A | Method of drilling vias and through holes | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7169313B2 | Plating method for circuitized substrates | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6841228B2 | Structure having embedded flush circuitry features and method of fabricating | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6383617B1 | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby | Emerging Cross-Sectional Technologies | 0 | Expired |
| US6663786B2 | Structure having embedded flush circuitry features and method of fabricating | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.