Laser machining of semiconductor materials
US6841482B2 · kind B2 · utility
33Cited by
10References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 26, 2001 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | May 10, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor is cut by directing a green laser beam of high power, and subsequently directing a UV beam along the cut line. The first beam performs cutting with relatively rough edges and a high material removal rate, and the second beam completes the cut at the edges for the required finish, with a lower material quantity removal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.