Composite Adhesive
US6841615B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2001 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Apr 27, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2479/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composite adhesive featuring a matrix phase that includes a cyanate ester and a filler or reinforcement phase that includes a plurality of bodies of at least one material comprising a high shear strength and/or high modulus material. Preferably, the filler also possesses at least one of high thermal conductivity and low coefficient of thermal expansion. Unlike certain commercially available cyanate esters, those of the instant invention substantially maintain or even increase in strength upon addition of the filler to the system. The instant composite adhesives may also display reduced coefficients of moisture expansion relative to the unfilled or “neat” resin. Such a composite adhesive is extremely useful for joining articles where high strength and minimal swelling in moist environments are required, such as in the precision equipment industry. In particular, the instant adhesives find great utility in joining components for semiconductor fabrication equipment, such as those that support the optics in a lithography machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.