M Cubed Technologies, Inc.
21Patents
9Active
21Granted
41Portfolio score
Filing activity: Aug 20, 1999 → Feb 21, 2018 · 2 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6609452B1 | Silicon carbide armor bodies, and methods for making same | Emerging Cross-Sectional Technologies | 52 | Expired |
| US6862970B2 | Boron carbide composite bodies, and methods for making same | Chemistry; Metallurgy | 40 | Expired |
| US6805034B1 | Silicon carbide armor bodies, and methods for making same | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6995103B2 | Toughness enhanced silicon-containing composite bodies, and methods for making same | Chemistry; Metallurgy | 24 | Expired |
| US6503572B1 | Silicon carbide composites and methods for making same | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6919127B2 | Silicon carbide composites, and methods for making same | Emerging Cross-Sectional Technologies | 14 | Expired |
| US7332221B2 | Boron carbide composite bodies, and methods for making same | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6884511B1 | Method for brazing ceramic-containing bodies, and articles made thereby | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7244034B1 | Low CTE metal-ceramic composite articles, and methods for making same | Emerging Cross-Sectional Technologies | 11 | Expired |
| US9941148B2 | Wafer pin chuck fabrication and repair | Electricity | 10 | Active |
| US8128861B1 | Composite materials and methods for making same | Chemistry; Metallurgy | 10 | Active |
| US6355340B1 | Low expansion metal matrix composites | Emerging Cross-Sectional Technologies | 9 | Expired |
| US8474362B1 | Diamond-reinforced composite materials and articles, and methods for making same | Chemistry; Metallurgy | 8 | Active |
| US6863759B2 | Methods for making composite bonded structures | Chemistry; Metallurgy | 8 | Expired |
| US6841615B2 | Composite Adhesive | Chemistry; Metallurgy | 3 | Expired |
| US10702968B2 | Machine for finishing a work piece, and having a highly controllable treatment tool | Performing Operations; Transporting | 0 | Active |
| US10790181B2 | Wafer chuck featuring reduced friction support surface | Performing Operations; Transporting | 0 | Active |
| US11370082B2 | Diamond composite CMP pad conditioner | Performing Operations; Transporting | 0 | Active |
| US10242905B2 | Wafer pin chuck fabrication and repair | Electricity | 0 | Active |
| US10792778B2 | Method for removing contamination from a chuck surface | Electricity | 0 | Active |
| US10953513B2 | Method for deterministic finishing of a chuck surface | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.