Patent · US Expired

Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip

US6841857B2 · kind B2 · utility

7Cited by

9References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Gottfried Beer · Nittendorf, DE
Robert Bergmann · Regensburg, DE
Heng Wan Hong · Singapore, SG

Key dates

Filing date	Jul 18, 2002
Grant date	Jan 11, 2005
Priority date	—
Expiry date	Jul 29, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic component and a system carrier having a heat conduction block, on which overlapping inner flat conductor ends are fixed mechanically and insulated electrically by an organoceramic layer (6). In addition, methods of producing the system carrier and the electronic component are encompassed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.