System and method for detecting location of a defective electrical connection within an integrated circuit
US6842021B1 · kind B1 · utility
4Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2003 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Nov 7, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and system for detecting the location of a defect within an integrated circuit (IC). With power applied to the IC via its power supply terminals (VDD, VSS), an infrared (IR) laser light is scanned along the X and Y dimensions of a surface of the IC. Reflected IR light and the IC power supply current are measured and processed using Fourier Transformation computations. Based upon the results of such computations, the Z coordinate is determined that corresponds to the depth of the defect within the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.