Metal dry etch using electronic field
US6843893B2 · kind B2 · utility
0Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2002 |
| Grant date | Jan 18, 2005 |
| Priority date | — |
| Expiry date | Dec 12, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F4/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and structure for an apparatus for removing metal from an integrated circuit structure is disclosed. A container holds an integrated circuit structure that has a metal portion. An electronic device connected to the container produces an electronic field proximate to a limited region of the metal portion. A first supply connected to the container supplies an oxidizing agent within the container. A solvent supply connected to the container supplies solvent to the limited region of the metal portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.