Microelectromechanical system based sensors, sensor arrays, sensing systems, sensing methods and methods of fabrication
US6844214B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2003 |
| Grant date | Jan 18, 2005 |
| Priority date | — |
| Expiry date | Aug 21, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/52
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microelectromechanical system (MEMS) based sensor comprises: a substrate defining a plane; a first conductive material layer having a first stress, a first portion of the first conductive material layer being connected to the substrate and extending in a substantially parallel direction to the plane defined by the substrate and a second portion being disconnected from the substrate and extending in a substantially non-parallel direction to the plane defined by the substrate; and a sensor material layer formed over at least the second portion of the first conductive material layer, the sensor material layer having a second stress that is less than the first stress of the first conductive material layer. The stresses form a stress gradient that bends the second portion of the first conductive material layer and the sensor material layer formed over the second portion of the first conductive material layer away from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.