Method of doping silicon, metal doped silicon, method of making solar cells, and solar cells
US6844248B2 · kind B2 · utility
6Cited by
13References
50Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2003 |
| Grant date | Jan 18, 2005 |
| Priority date | — |
| Expiry date | Jul 14, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A low temperature process for forming a metal doped silicon layer in which a silicon layer is deposited onto a substrate at low temperatures, with a metal doping layer then deposited upon the silicon layer. This structure is then annealed at low temperatures to form a metal doped semiconductor having greater than about 1×1020 dopant atoms per cm3 of silicon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.