Hot wall rapid thermal processor
US6844528B2 · kind B2 · utility
4Cited by
23References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2002 |
| Grant date | Jan 18, 2005 |
| Priority date | — |
| Expiry date | Sep 30, 2022 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D2003/0075
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for heat treatment of a wafer. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.