Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
US6845184B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 1999 |
| Grant date | Jan 18, 2005 |
| Priority date | — |
| Expiry date | Apr 20, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Opto-electrical systems having electrical and optical interconnections formed in thin layers are disclosed. In one set of preferred embodiments, optical signals are conveyed between layers by respective vertical optical couplers disposed on the layers. In other preferred embodiments, optical signals are conveyed by stack optical waveguide coupling means. Yet other preferred embodiments have electrical via means formed in one or more layers to covey electrical signals between two or more layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.