Edge gripping device for handling a set of semiconductor wafers in an immersion processing system
US6845779B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2002 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Nov 11, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic substrate handling device comprising first and second support structures spaced from each other, the first support structure having a series of upper teeth defining a series of upper notches extending along a length of the first support structure and a series of lower teeth defining a series of lower notches extending along a length of the first support structure, each of the upper and lower notches opening toward the second support structure, wherein the upper and lower notches are offset from each other by a predetermined offset distance so that an edge of a microelectronic device will fit differently within the upper and lower notches of the first support structure when supported between the first and second support structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.