Semiconductor device with heat-dissipating capability
US6847111B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2003 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Oct 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor device, a semiconductor chip is mounted on an inner seat body of a heat-dissipating frame mounted on a top surface of a dielectric substrate. Each of multiple bonding wires interconnects electrically one of multiple contact pads on the semiconductor chip and a corresponding one of multiple first conductive contacts on the top surface of the substrate so as to establish electrical connection between the contact pads on the semiconductor chip and multiple second conductive contacts on a bottom surface of the substrate via the first conductive contacts and circuit traces of the substrate. An encapsulant encapsulates the bonding wires, the semiconductor chip, and the inner seat body, a portion of an outer frame body of the heat-dissipating frame, and multiple that interconnect portions interconnecting heat-conductively the inner seat body and the outer frame body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.