Semiconductor device and manufacturing the same
US6847112B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 13, 2002 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Dec 13, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is designed to resist warpage of a heat sink with an inexpensive construction. The device comprises a heat sink, a pair of screwing pieces having inner end portions connected to ends of the heat sink and outer end portions formed with through spaces for screwing, a semiconductor chip fixed to a main surface of the heat sink, a seal covering a back side of the heat sink and partially covering the paired screwing pieces, first and second leads having outer end portions projecting from the seal member and inner end portions within the seal member near respective side faces of the heat sink, and conductive wires electrically connecting the leads and predetermined electrodes of a semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.