Probe card with an adapter layer for testing integrated circuits
US6847218B1 · kind B1 · utility
17Cited by
12References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2002 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | May 13, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07307
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, an environment for testing integrated circuits includes a first die coupled to a tester. The first die includes a removable connection configured to couple a signal from the first die with an adapter layer to a second die being tested. The removable connection may be an elastomeric interposer or a probe, for example.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.