Method of forming an out-of-plane structure
US6848175B2 · kind B2 · utility
23Cited by
27References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2003 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | Aug 4, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49218
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the springs used to form out-of-plane structures are constrained via a tether to avoid bunching and entanglement. The high yield structure may be used in numerous electronic applications such as filter circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.