Process for manufacturing flexible wiring boards
US6848176B2 · kind B2 · utility
3Cited by
17References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2003 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | Aug 14, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing a flexible wiring board according to the present invention comprises growing metal bumps 16 using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps 16 can be formed with good precision because laser beam is not used to form openings in a polyimide film. After metal bumps 16 have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps 16.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.