Barrier layers for microelectromechanical systems
US6849471B2 · kind B2 · utility
93Cited by
35References
63Claims
0Family size
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Key dates
| Filing date | Mar 28, 2003 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | Mar 28, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/053
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for processing microelectromechanical devices is disclosed herein. The method prevents the diffusion and interaction between sacrificial layers and structure layers of the microelectromechanical devices by providing selected barrier layers between consecutive sacrificial and structure layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.