Semiconductor wafer protection and cleaning for device separation using laser ablation
US6849524B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2002 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | May 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/94
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of protecting and cleaning a semiconductor wafer using laser ablation includes the following steps: applies a protective coating on the side to be cut of a wafer with sapphire substrate, mounts the other side of the sapphire wafer on an adhesive tape, mounts the sapphire wafer on a cutting table, cuts the sapphire wafer with a laser, breaks the sapphire wafer into die, and cleans the sapphire wafer with a cleaning solution that removes slag resulting from the cutting, debris resulting from the breaking, and the protective coating, but the adhesive tape, the cleaning solution, and the protective coating are selected such that the cleaning solution does not damage the adhesive tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.