1R1D R-RAM array with floating p-well
US6849564B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2003 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | Feb 27, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2213/72
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A low-capacitance one-resistor/one-diode (1R1D) R-RAM array with a floating p-well is provided. The fabrication method comprises: forming an integrated circuit (IC) substrate; forming an n-doped buried layer (buried n layer) of silicon overlying the substrate; forming n-doped silicon sidewalls overlying the buried n layer; forming a p-doped well of silicon (p-well) overlying the buried n layer; and, forming a 1R1D R-RAM array overlying the p-well. Typically, the combination of the buried n layer and the n-doped sidewalls form an n-doped well (n-well) of silicon. Then, the p-well is formed inside the n-well. In other aspects, the p-well has sidewalls, and the method further comprises: forming an oxide insulator overlying the p-well sidewalls, between the n-well and the R-RAM array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.