Flat mount with at least one semiconductor chip
US6850420B2 · kind B2 · utility
1Cited by
6References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 28, 2002 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | Aug 13, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG07D7/01
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
The flat mount assembly, or transponder, has at least one semiconductor chip that is connected to an antenna for interchanging data and power with an electronic apparatus. The antenna is formed of two electrical conductors. A conductive layer is formed on the mount in overlapping relationship with the electrical conductors of the antenna. The overlapping conductive layer results in greater capacitive coupling between the electronic apparatus and the flat mount assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.