Patent · US Expired

Method and apparatus for localized liquid treatment of the surface of a substrate

US6851435B2 · kind B2 · utility

33Cited by

11References

27Claims

0Family size

Assignee

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW · BE

Inventors

Paul Mertens · Haacht, BE
Marc Meuris · Keerbergen, BE
Marc Heyns · Linden, BE

Key dates

Filing date	Feb 13, 2002
Grant date	Feb 8, 2005
Priority date	—
Expiry date	Mar 9, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S134/902
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and apparatus for dispensing a liquid on the surface of a localized zone of a substrate, for example for cleaning of etching purposes. Along with the liquid, a gaseous tensio-active substance is supplied, which is miscible with said liquid and when mixed with the liquid, reduces the surface tension of said liquid, thus containing the liquid in a local zone of the substrate surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.