Adhesives for bonding composites
US6852801B1 · kind B1 · utility
24Cited by
16References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2003 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Aug 5, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J4/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive composition, including a mixture of about 1 percent to about 35 percent by weight of chlorinated polymer, about 1 percent to about 35 percent by weight of a nitrile elastomer, a rubber-modified acrylonitrile copolymer, or mixtures thereof, about 25 percent to about 90 percent by weight of an alkyl acrylate or methacrylate monomer and about 0.01 to about 30 weight percent of a core shell impact modifier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.