Electrostatic discharge depolarization using high density plasma
US6852990B1 · kind B1 · utility
2Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2001 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Jan 2, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/0041
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for electrostatic discharge depolarization is implemented. The buildup of charge on tool structures in fabrication tools for semiconductor processing may be expected to be of concern whenever high voltage is employed near the structure in a tool. The process herein includes selectively exposing the structure to a plasma for a selected time interval. The duration of the exposure time interval is sufficient to reduce the polarization of the structure whereby the forces due to the polarization do not interfere with the transport or movement of a wafer being processed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.