Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
US6853076B2 · kind B2 · utility
132Cited by
15References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2001 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Jan 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.