Modular method for chemical mechanical planarization
US6855030B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 19, 2002 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Jan 16, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67173
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Specific embodiments of the present invention are directed to a method of operating a modular chemical mechanical planarization process. The method comprises operating CMP apparatus comprising a docking station having at least one CMP module and at least one cleaning module to process one or more substrates therein. The plurality of modules are controllable separately by individual controllers associated separately with the modules. One of the modules is disengaged from the docking station, and is mechanically removed to free the module from the docking station, while the other modules are still operable to process the one or more substrates therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.