Plating method and apparatus using contactless electrode
US6855239B1 · kind B1 · utility
12Cited by
3References
41Claims
0Family size
Inventor
Key dates
| Filing date | Sep 27, 2002 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Jul 23, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating method and apparatus using contactless electrode is described. In one embodiment an inductive element is placed proximally to a substrate and a moving electromagnetic field generates an emf in the substrate to plate the surface. In another embodiment, a conductive plate is used, so that the conductive plate and the wafer, separated by a dielectric material, operate as two plates of a capacitor when voltage is applied to the conductive plate. The resulting electrostatic field impresses a charge potential on the substrate to plate the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.