Semiconductor device and semiconductor package
US6855952B2 · kind B2 · utility
1Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2003 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Mar 28, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31931
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device wherein a resin containing as a cross-linking component a compound having a plurality of styrene group and represented by chemical formula [1] is used as an insulating material: where R is a hydrocarbon structure which may have a substituent group or groups, R1 is hydrogen, methyl, or ethyl, m is and integer of 1 to 4, and n is an integer of not less than 2. With this, a semiconductor device and a semiconductor package which show excellent transmission characteristics and less power consumption are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.