Semiconductor device having an improved mounting structure
US6856028B1 · kind B1 · utility
0Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2000 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Sep 20, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor device, a semiconductor element is bonded to an insulating circuit board. A resin layer for bonding the semiconductor element to the insulating circuit board is extended so as to become greater in size than the semiconductor element. Further, the surroundings of the semiconductor element are sealed with resin. Reliability of mounting is improved by alleviating stress developing in a solder joint of the external electrodes of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.