CMP slurry additive for foreign matter detection

US6857434B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Kwong Hon Wong · Wappingers Falls, US
• Karl E. Boggs · Hopewell Junction, US
• Raphael Mitchell · Wawarsing, US
• Uldis A. Ziemins · Poughkeepsie, US

Key dates

• Filing date: Jan 24, 2002
• Grant date: Feb 22, 2005
• Expiry date: Oct 3, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02024
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

A method and structure polishes and cleans silicon wafers by mixing a marker with a slurry to form a slurry mixture, performs chemical mechanical polishing on a silicon wafer using the slurry mixture, rinses the slurry mixture from the silicon wafer, checks the silicon wafer for marker residue, and repeats the rinsing process if the checking process detects the marker residue on the wafer.