Device and process for liquid treatment of wafer-shaped articles
US6858092B2 · kind B2 · utility
35Cited by
13References
38Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 10, 2002 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | Jun 10, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.