SEZ AG
13Patents
0Active
13Granted
29Portfolio score
Filing activity: Nov 16, 1999 → Mar 6, 2006
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6494221B1 | Device for wet etching an edge of a semiconductor disk | Emerging Cross-Sectional Technologies | 69 | Expired |
| US6536454B2 | Device for treating a disc-shaped object | Emerging Cross-Sectional Technologies | 47 | Expired |
| US6858092B2 | Device and process for liquid treatment of wafer-shaped articles | Emerging Cross-Sectional Technologies | 35 | Expired |
| US7270510B2 | Device and method for transporting wafer-shaped articles | Emerging Cross-Sectional Technologies | 19 | Expired |
| US7007702B2 | Device and process for liquid treatment of wafer-shaped articles | Emerging Cross-Sectional Technologies | 13 | Expired |
| US7172674B2 | Device for liquid treatment of wafer-shaped articles | Electricity | 9 | Expired |
| US7279116B2 | Method for the wet treatment of disk-like objects | Electricity | 8 | Expired |
| US7122084B2 | Device for liquid treatment of disk-shaped objects | Electricity | 6 | Expired |
| US7267129B2 | Device and process for liquid treatment of wafer-shaped articles | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7057973B2 | Method and device for measuring cavitation | Physics | 3 | Expired |
| US7052577B2 | Annular receptacle for a rotating carrier | Electricity | 2 | Expired |
| US7179753B2 | Process for planarizing substrates of semiconductor technology | Electricity | 1 | Expired |
| US7078340B2 | Metal deposit process | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.