System and a method for fluid filling wafer level packages
US6858466B1 · kind B1 · utility
6Cited by
6References
61Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2003 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | Nov 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fluid filling system includes a vacuum filling chamber configured to receive a wafer, a conduit coupled to the vacuum filling chamber, and a vacuum pump fluidly coupled to the vacuum filling chamber through the conduit, the vacuum pump being configured to create a vacuum within the wafer level packaging cavity, wherein the vacuum filling chamber includes a body having a vacuum orifice, a first substrate sealingly coupled to the body to seal a first end of the vacuum orifice, and a second substrate sealingly coupled to the body to seal a second end of the vacuum orifice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.