Kirby Sand
12Patents
3h-index
12Co-inventors
49Inventor score
Filing activity: Nov 3, 2003 → Oct 4, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7303976B2 | Wafer bonding method | Electricity | 44 | Expired |
| US7828417B2 | Microfluidic device and a fluid ejection device incorporating the same | Performing Operations; Transporting | 17 | Active |
| US6858466B1 | System and a method for fluid filling wafer level packages | Electricity | 6 | Expired |
| US7320899B2 | Micro-displays and their manufacture | Physics | 3 | Expired |
| US7766462B2 | Method for forming a fluid ejection device | Emerging Cross-Sectional Technologies | 3 | Active |
| US8043880B2 | Microelectronic device | Performing Operations; Transporting | 2 | Active |
| US8007078B2 | Microfluidic device and a fluid ejection device incorporating the same | Performing Operations; Transporting | 1 | Active |
| US8390111B2 | Wafer bonding method | Electricity | 1 | Active |
| US7611919B2 | Bonding interface for micro-device packaging | Performing Operations; Transporting | 1 | Active |
| US7723811B2 | Packaged MEMS device assembly | Electricity | 1 | Active |
| US7618682B2 | Method for providing an anti-stiction coating on a metal surface | Chemistry; Metallurgy | 0 | Active |
| US7988264B2 | Method for forming a fluid ejection device | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.